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Brand Name : OEM and ODM
Model Number : SL81106S01
Certification : UL,RoHS, CE
Place of Origin : China
MOQ : 1pc
Price : Negotiable
Payment Terms : T/T, Western Union, MoneyGram,Paypal
Supply Ability : 100000pcs per day
Delivery Time : 5-7 days
Packaging Details : ESD package
Type : PCM/BMS/PCB
Surface Finishing : L-F HASL
Min.Line Width : 3mil
Features 1 : Gerber/PCB file needed
Features 2 : 100% E-test
Features 3 : Quality 2 years guarantee
pcba Board manufacturer Fast Fiber Optical Transceiver Motherboard PCBA
Product parameters
Indicators: 6, 1 power light, 2 fiber lights, 3 network port lights
Electrical port: RJ-45, 10/100Mbps (adaptive) Category 5 (up to 100m)
Optical port: can be equipped with ST/SC/FC, 100Mbps (full duplex)
Power Supply: 5V1A
Ambient temperature: -20 to +65°C
Storage temperature: -40~+80°C
Humidity: 5% to 90%
Files Requested For PCB Assembly Quotation
---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required
Shinelink kinds PCBA Product
94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly
SMT process (RoHs Compliant) Capabilities up to:
1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils
THT(Wave soldering) process (RoHs Compliant) Capabilities up to:
1.Single side wave soldering
2.SMT & THT mixture process
Module circuit boardTechnical capability
SMT | Position accuracy:20 um |
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
Max. component height::25mm | |
Max. PCB size:680×500mm | |
Min. PCB size:no limited | |
PCB thickness:0.3 to 6mm | |
PCB weight:3KG | |
Wave-Solder | Max. PCB width:450mm |
Min. PCB width: no limited | |
Component height:Top 120mm/Bot 15mm | |
Sweat-Solder | Metal type :part, whole, inlay, sidestep |
Metal material:Copper , Aluminum | |
Surface Finish:plating Au, plating sliver , plating Sn | |
Air bladder rate:less than20% | |
Press-fit | Press range:0-50KN |
Max. PCB size:800X600mm | |
Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
PCBA Picture
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L-F HASL Surface Printed Circuit Board Assembly Fast Transceiver Motherboard PCBA Images |