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Shenzhen Shinelink Technology Ltd
Shenzhen Shinelink Technology Ltd OEM PCB & PCBA Manufacturer (EMS Service)
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Rigid Multilayer PCB Prototype High Density 8 Layer Immersion Gold PCB Board

Shenzhen Shinelink Technology Ltd

Rigid Multilayer PCB Prototype High Density 8 Layer Immersion Gold PCB Board

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Brand Name : OEM and ODM

Model Number : SL80813S003

Certification : UL,RoHS, CE

Place of Origin : China

MOQ : 1pc

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram,Paypal

Supply Ability : 1000pcs per day

Delivery Time : 5-7 days

Packaging Details : ESD package

PCB Layer : 8 layers

Soldermask : Green

Legend color : White

Features 1 : Gerber/PCB file needed

Features 2 : 100% E-test

Features 3 : Quality 2 years guarantee

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Rigid Multilayer PCB , High Density 8 Layer Immersion Gold PCB

8 layers PCBSpecification:

8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.


Advantage Highlights

  • Specialized in 2- to 32-layer PCB

  • ISO 9001-, ISO 14001- and ISO/TS 16949-certified

  • Products are UL- and RoHS-certified

  • Partner for over 2000 small- and medium-scale customers

  • Two factory bases totaling 22,000 square meters

  • Less than 12-hours quick response to inquiries

  • Widely acclaimed and satisfying services

  • Over 66% of PCBs are exported to international markets

Parameter:

Item

Data

1

Layer:

1 to 18 layers

2

Material type:

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

3

Board thickness:

0.20mm to 3.4mm

4

Copper thickness:

0.5 OZ to 4 OZ

5

Copper thickness in hole:

>25.0 um (>1mil)

6

Max. Board Size:

(580mm×1200mm)

7

Min. Drilled Hole Size:

4mil(0.1mm)

8

Min. Line Width:

3mil (0.075mm)

9

Min. Line Spacing:

3mil (0.075mm)

10

Surface finishing:

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

11

Solder Mask Color:

Green/Yellow/Black/White/Red/Blue

12

Shape tolerance:

±0.13

13

Hole tolerance:

PTH: ±0.076 NPTH: ±0.05

14

Package:

Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing

15

Certificate:

UL,SGS,ISO 9001:2008

16

Special requirements:

Buried and blind vias+controlled impedance +BGA

17

Profiling:

Punching, Routing, V-CUT, Beveling


Place of Origin:


Guangdong China (Mainland)


Brand Name:


OEM/ODM


Model Number:


No


Base Material:


FR4


Copper Thickness:


0.3-3oz


Board Thickness:


0.3-6mm


Min. Hole Size:


0.2mm


Min. Line Width:


3mil


Min. Line Spacing:


3mil


Surface Finishing:


HASL, OSP, Immersion Gold/Au, Immersion silver, etc.


Solder mask:

Green


PCB Standard:


IPC-A-610 E Class II-III


Wrap and twist:


5%


Layer Count:


1-22


profiling punching:


Routing, V-CUT, Beveling


Max board size:


1200mm*600mm


Hole tolerance:


PTH:±0.075,NTPH:±0.05


PCB Tolerance of finished thickness:


±5%


PCB:


Customized


Product name:


pcb

PCB Picture

Rigid Multilayer PCB Prototype High Density 8 Layer Immersion Gold PCB Board


Product Tags:

electronics prototyping board

      

prototype printed circuit board

      
Quality Rigid Multilayer PCB Prototype High Density 8 Layer Immersion Gold PCB Board for sale

Rigid Multilayer PCB Prototype High Density 8 Layer Immersion Gold PCB Board Images

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